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    A800LS

    The miniaturized layout design of A800LS allows maintenance and other operations to be carried out in the gray area, saving clean room space. The corresponding maintenance operations are simpler, with fewer consumables used, meeting the high repeatability and high reliability coating requirements for industrialization.

    Overview

    The miniaturized layout design of A800LS allows maintenance and other operations to be carried out in the gray area, saving clean room space. The corresponding maintenance operations are simpler, with fewer consumables used, meeting the high repeatability and high reliability coating requirements for industrialization.

    Industrialized design for the LED industry, compatible with various sizes of wafers

    Advanced PLC control system compatible with Industry 4.0

    High accuracy process control

    Shorter ALD cycle time and less precursor source consumption

    Highest production, lowest production consumption

    Optimal film uniformity and repeatability

    Feature and advantage

    Substrate

    4/6-inch standard wafer can hold up to 150/50 chips

    Process temperature

    70℃ – 300℃

    Deposited film

    Al2O3 film: standard configuration for aluminum source and water source location, optional with precursor sources such as ozone

    ALD performance

    Large loading capacity and short coating time

    Better than 1.0% film uniformity(1σ, 5mmEE).

    Highly competitive equipment performance and film uniformity

    Conformal coverage >94%

    Continuous non pinhole alumina barrier film with superior water vapor barrier can greatly improve the lifespan of Mini LED; And the thin film has high breakdown voltage performance

    Emi level high-precision film thickness controllability and high production reliability

    Loading method

    Manual loading

    Semi-automatic loading

    Fully automatic loading

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